Semiconductor Chip Design Compute jobs Errors and Warnings solutions provider based on Machine learning Prediction systems

Authors

  • Vidhu Shekhar Bajpai Research Scholar

DOI:

https://doi.org/10.22399/ijcesen.3806

Keywords:

Machine learning, semiconductor physical design, error prediction, EDA automation, design optimization

Abstract

Significant error and warning data are generated by semiconductor physical design methods during the place-and-route process, which creates challenges and incurs significant costs in development time and impacts engineering productivity. Existing manual debugging methods require vast resources and can severely impact the time-to-market. This work presents an intelligent prediction method that uses machine learning algorithms to automatically predict and suggest a resolution for design errors during the synthesis, placement, clock tree synthesis, and routing phases of designs. The prediction system was built to operate seamlessly with widely-adopted EDA tools, such a Synopsys Fusion Compiler and Cadence Innovus, and can handle multi-dimensional information of timing violations, congestion patterns, power distribution, and design rule violations. The ability to use the latest multi-class classification and multi-output regression models allows the process of detecting errors and suggesting resolutions to occur before the design is complete for the four critical design processes. The framework shows substantial efficiencies over existing design cycle times and is particularly beneficial for complex designs that have multiple voltage domains, frequent power management requests, and mixed-signal technologies. The system has been implemented across several technology nodes and has proven to be robust and adaptive across the possible design work to be conducted. By leveraging an automated method, the need for design engineers to manually intervene in the design process was maintained while fulfilling industry design quality standards. In summary, the intelligent framework has turned the development process from reactive debugging into a preventative debugging model to provide a new platform for semiconductor design automation.

 

References

[1] Niranjana Gurushankar, "Physical Verification Techniques in Advanced Semiconductor Nodes," ESP International Journal of Advancements in Computational Technology (ESP-IJACT), Volume 1, Issue 2, 30 September 2023. https://www.espjournals.org/IJACT/2023/Volume1-Issue2/IJACT-V1I2P115.pdf

[2] Sean Safarpour, Andreas Veneris, "Automated Design Debugging With Abstraction and Refinement," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (IEEE TCAD), Vol. 28, No. 9, 10 October 2009. https://www.eecg.toronto.edu/~veneris/TCAD09.pdf DOI: https://doi.org/10.1109/TCAD.2009.2030593

[3] Guyue Huang, et al., "Machine Learning for Electronic Design Automation: A Survey,", Vol. 26, No. 3, June 2021. https://nicsefc.ee.tsinghua.edu.cn/nics_file/pdf/publications/2021/TODAES21_331_mzGV3SA.pdf

[4] Haoyu Yang, et al., "Optimizing Predictive AI in Physical Design Flows with Mini Pixel Batch Gradient Descent," arXiv preprint, 8 February 2024. https://arxiv.org/abs/2402.06034

[5] Daniela Sánchez Lopera, et al., "Using Open-Source EDA Tools in an Industrial Design Flow," DVCon Europe Proceedings (IEEE-affiliated conference). https://dvcon-proceedings.org/wp-content/uploads/74522.pdf

[6] Jeff Heaton, "An Empirical Analysis of Feature Engineering for Predictive Modeling," arXiv, 1 Nov 2020. https://arxiv.org/pdf/1701.07852

[7] Boran Sekeroglu, et al., "Comparative Evaluation and Comprehensive Analysis of Machine Learning Models for Regression Problems," Data Intelligence, co-published by MIT Press and IEEE, Vol. 4, No. 3, 01 July 2022. https://direct.mit.edu/dint/article/4/3/620/112544/Comparative-Evaluation-and-Comprehensive-Analysis DOI: https://doi.org/10.1162/dint_a_00155

[8] Andrew B. Kahng, et al., "PPA-Relevant Clustering-Driven Placement for Large-Scale VLSI Designs," 61st ACM/IEEE Design Automation Conference (DAC '24), June 2024. https://vlsicad.ucsd.edu/Publications/Conferences/410/c410.pdf DOI: https://doi.org/10.1145/3649329.3655991

[9] Gabriel do N. Silveira, et al., "I4.0 Pilot Project on a Semiconductor Industry: Implementation and Lessons Learned," Sensors (IEEE-affiliated open access journal), 10 October 2020. https://www.mdpi.com/1424-8220/20/20/5752 DOI: https://doi.org/10.3390/s20205752

[10] Chang-Jiun Lai, Ming-Dou Ker, "Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection, 25 March 2025. https://alab.iee.nycu.edu.tw/~mdker/Referred%20Journal%20Papers/2025.03_Real-time%20ESD%20monitoring%20and%20control%20in%20semiconductor%20manufacturing%20environments.pdf

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Published

2025-09-01

How to Cite

Shekhar Bajpai, V. (2025). Semiconductor Chip Design Compute jobs Errors and Warnings solutions provider based on Machine learning Prediction systems. International Journal of Computational and Experimental Science and Engineering, 11(3). https://doi.org/10.22399/ijcesen.3806

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Section

Research Article